What is a common cause for solder failing to adhere to a joint?

The statement identifying the melting point and flow points as a cause for solder failing to adhere to a joint would relate more to the characteristics of the solder material rather than the common practice errors that lead to poor adhesion. While it is important for solder to have appropriate melting and flow characteristics, the primary issues with solder adherence typically stem from preparation and application techniques used during the soldering process.

For instance, one of the most prevalent causes of solder failure is the cleanliness of the surfaces being joined. If the surfaces are contaminated with grease, dirt, or oxidation, the solder cannot make a good physical or chemical bond, leading to weak joints. Proper cleaning of surfaces is essential to ensure that solder can properly wet the surfaces and create a solid connection.

Other aspects, such as ensuring the joint is heated adequately, play a crucial role as well. If the joint is not heated sufficiently, the solder will not flow properly, which can also prevent proper adhesion. Solder applications depend heavily on both the preparation of the surfaces and the conditions under which the soldering is performed.

While the age of solder can affect its performance, it is less likely to be the primary cause of adhesion failure when compared to joint cleanliness and heating practices. Thus, focusing on the preparation of surfaces